NEWS

Recently, the 3rd International AI Data Center Liquid Cooling Supply Chain Summit was held in Shenzhen. INVT was invited to attend, setting up a dedicated booth and delivering a keynote speech titled "Gradual Smart Cooling: Breaking the Bottleneck with Hybrid Solutions." The company joined industry peers to explore the evolutionary path and industrial synergy of data center cooling technologies in the AI era.

The summit gathered numerous enterprises and industry experts from the entire liquid cooling supply chain to engage in deep discussions on cutting-edge trends, implementation paths, and ecosystem development. As a veteran in the network energy sector, INVT showcased its systematic thinking and full-stack solutions for a smooth transition from air cooling to liquid cooling, centered around its core concept of "Air-Liquid Hybrid Cooling."

Gradual Smart Cooling: Breaking the Bottleneck with Hybrid Solutions

At the summit, the Head of INVT's Network Energy Product Line delivered a keynote speech. He pointed out that data centers are currently at a critical turning point of technological paradigm shift under the triple constraints of "cooling, energy efficiency, and density." The power consumption of AI chips has completely surpassed the limit of traditional air cooling (approx. 750W), while stringent PUE policies run parallel to energy efficiency optimizations hitting their ceilings. Traditional air-cooling and AC power distribution architectures are struggling to support rack densities above 35 kW.

Meanwhile, large-scale domestic deployment of liquid cooling still faces a gap due to market and chip supply constraints, with most projects remaining in the pilot phase. Facing this reality, INVT proposes "Air-Liquid Hybrid Cooling" as a feasible and essential transitional path at this stage. INVT advocates for maximizing the use of existing air-cooling infrastructure and achieving an integrated air-liquid design with a controllable air-to-liquid ratio. By precisely and gradually embedding liquid cooling capabilities through smart air-liquid fusion, enterprises can achieve controllable initial investment, flexible expansion, and smooth evolution.

Full-Stack Smart Control: Win-Win Ecosystem

INVT highlighted its UPS power supply product line, high-efficiency data center cooling solutions, and the Smart Series integrated data center solutions. Leveraging over a decade of R&D in critical equipment and 100% in-house R&D and manufacturing integration capabilities, INVT has built a comprehensive product matrix spanning power supply, thermal management, and dynamic environment monitoring.

To address different application scenarios, INVT launched targeted solutions covering five major scenarios: local high-density retrofitting of traditional air-cooled data centers, liquid cooling pilots for edge/micro nodes, air-liquid fusion deployment for new medium-to-large data centers, hyper-scale AIDC air-liquid hybrid clusters, and prefabricated air-liquid integrated containers. These solutions provide customers with a "definitive, smooth, and efficient evolutionary path."

INVT's successful participation in this summit not only demonstrates its technical strength but also marks an accelerated rollout of the company's forward-looking strategy in the liquid cooling track. Moving forward, INVT will remain committed to its mission of "Leading Smart Industry, Co-creating a Zero-Carbon Future." With an open and collaborative approach, INVT will join hands with supply chain partners to build high-efficiency computing infrastructure for the AI era, contributing to the high-quality growth of the digital economy.