INVT will showcase its AI-ready data centre power and cooling solutions at Data Centre World Frankfurt 2026 (May 6–7, Messe Frankfurt, Booth 8K131), focusing on next-generation infrastructure for high-density, AI-driven environments. The exhibition highlights modular UPS systems and high-density power modules designed to deliver scalable, efficient, and reliable backup power for evolving data centre demands.
In addition, INVT will present its rack-mounted UPS solutions for edge applications and SC Series CDU liquid cooling technology, providing advanced thermal management for AI and HPC workloads. These solutions support improved energy efficiency, flexible deployment, and sustainable operation in modern data centre infrastructures.
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